◆◇　Event information ( in the MOBIO Tech Hall )◆◇

Date : May 21 (Tue) PM 6:00 - PM 8:00

Admission : Free (Costing JPY1,000 to join a crossover gathering )
Contact Information : 1-4-17, Aramoto Kita, Higashi Osaka City, Osaka, 577-0011 Japan
Tel. +81-6-6748-1011

.

To be presented by

1) Injection molding products using super engineering plastics: DAIPLA CORPORATION

2) Package adhesives and adhesive films: LEADER CO., LTD.

etc.