◆◇ Event information ( in the MOBIO Technology Hall ) ◆◇

Date : Jul 11 (Tue) PM 6:00 - PM 8:30
Admission : Free (Costing JPY1,000 to join a party )
Contact Information : 1-4-17, Aramoto Kita, Higashi Osaka City, Osaka, 577-0011 Japan
Tel. +81-6-6748-1011

To be presented by 7 companies from "Osaka's Tech Surprise" exhibition

(Member of Team MOBIO)

SANGO METAL INDUSTRIAL CO., LTD.

Thin plate laser welding

SIMOTEC CO., LTD.

Module of three technologies (Mechatronics, Magnets, Thermal)

KOYO ENGINEERING CO., LTD.

Reclining gears

KYOEI DIECASTING CO., LTD. （Japanese WEB)

　Diecasted parts

MURAKAMI KOKI CO., LTD.

　Weights and balancesd Polymer

TAKAISHI-INDUSTRY CO., LTD.

　Rubber O-rings

YASHIMA DENGYO CO., LTD.

　Battery pack modelues