This is the state-of-the-art technology developed by Japanese SMEs. At the MOBIO Tech Hall and MOBIO WEB site, search for "The Latest Made in Japan Tech" to improve product features and functions.

BRIMATEC, LLC. https://www.m-osaka.com/en/exhibitors/1096/

BRIMATEC cuts brittle materials like ceramics, glass and semiconductors by use of the new "scribing and breaking" technology. Fast, inexpensive, and clean. Unlike conventional dicing process, no grinding fluid or washing is required. Ｍoreover, no kerf loss.

Click here to watch a video introducing its"S&B" processing techniques.

Please visit the MOBIO Tech Hall to see the latest technologies of Osaka exhibitors. Click here for a list of exhibitors.