This is the state-of-the-art technology developed by Japanese SMEs. At the MOBIO Tech Hall and MOBIO WEB site, search for "The Latest Made in Japan Tech" to improve product features and functions.　

On November 28, participants were able to casually ask anything, such as "The difference between "Scribe and Break" and cutting?", "What are the strengths of "Scribe & Break"?" at the MOBIO Cafe Meeting.

BRIMATEC, LLC https://www.m-osaka.com/en/exhibitors/1096/

To cut valuable materials for semiconductors, such as ceramics...

*No scraping off by a blades: No grinding water used, no cleaning required

*No Cutting allowance: Effective use of materials without waste
*No burrs or debris: No grinding, no melting at high temperatures

Watch the video for the rest of the story.

Please visit the MOBIO Tech Hall to see the latest technologies of new exhibitors. Click here for a list of exhibitors.

The next MOBIO Cafe Meeting by Tech Hall exhibitors will take place on December 15 with three exhibitors.

Read details from here https://www.m-osaka.com/en/whatsnew/detail/004942.html