Posted : Dec 08, 23

Category : Event

Thin plates are split without cutting! It is "Scribe and Break" materials of ceramics, glass, semiconductors / "Amazing Made in Japan Tech" by BRIMATEC, LLC

This is the state-of-the-art technology developed by Japanese SMEs. At the MOBIO Tech Hall and MOBIO WEB site, search for "The Latest Made in Japan Tech" to improve product features and functions. 

On November 28, participants were able to casually ask anything, such as "The difference between "Scribe and Break" and cutting?", "What are the strengths of "Scribe & Break"?" at the MOBIO Cafe Meeting.



To cut valuable materials for semiconductors, such as ceramics...

*No scraping off by a blades: No grinding water used, no cleaning required

*No Cutting allowance: Effective use of materials without waste
*No burrs or debris: No grinding, no melting at high temperatures


Watch the video for the rest of the story.


Please visit the MOBIO Tech Hall to see the latest technologies of new exhibitors. Click here for a list of exhibitors.


The next MOBIO Cafe Meeting by Tech Hall exhibitors will take place on December 15 with three exhibitors.

1215 MCM.jpg

Read details from here